Combine MEGA 2560 and Ramps1.4 into one, which solves the problem that the Ramps1.4 combination interface is cumbersome and easy to malfunction.
The circuit board uses a high-quality 4-layer board and is optimized for heat dissipation; the ramps are 2-layer boards.
Using high-quality MOSFET tube, better heat dissipation.
Using power chip, support 12V-24V power input, solve the heating problem of Ramps voltage conversion chip.
Can be 24V input, the same system power can reduce the hot bed current to 1/4, effectively solve the hot bed MOS tube heating problem.